MacDermid, Incorporated
MacDermid, Incorporated is named on 0 US grants and 4 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 0
- Published applications
- 4
- Inventors
- 7
- Granted in 2026 so far
- 0
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
By publication year.
Technology areas
Share of 4 documents
- H05KPrinted circuits4
- C23CCoating metallic material2
- C23FNon-mechanical removal of metallic material from surface2
- B41CProcesses for the manufacture or reproduction of printing surfaces1
- G03FPhotomechanical production of textured or patterned surfaces1
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests1
Recent patents
No granted patents yet.
- Selective catalytic activation of non-conductive substrates22 Nov 2007US 2007/0267298 A1
- Direct imaging process for forming resist pattern on a surface, compositions and use thereof in fabricating printed circuit boards and printing plates2 Jan 2003US 2003/0003406 A1
- Process for improving the adhesion of polymeric materials to metal surfaces12 Sep 2002US 2002/0124768 A1
- Composition and method for stripping tin or tin alloys from metal surfaces12 Jul 2001US 2001/0007317 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.