Lambda Research, Inc.
Cincinnati, OH, US· latest recorded location
Lambda Research, Inc. is named on 3 US grants and 0 published applications in this corpus. Its most frequent classification is B24B (Machines, devices, or processes for grinding or polishing).
- Granted patents
- 3
- Published applications
- 0
- Inventors
- 5
- Granted in 2026 so far
- 0
- Most recent grant
- 9 Aug 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
By publication year.
Technology areas
Share of 3 documents
- B24BMachines, devices, or processes for grinding or polishing2
- C21DModifying the physical structure of ferrous metals2
- Y10TTechnical subjects covered by former us classification2
- B23KSoldering or unsoldering1
- B23PMetal-working not otherwise provided for1
- G01NInvestigating or analysing materials by determining their chemical or physical properties1
Recent patents
- Apparatus and method for forming weld joints having compressive residual stress patterns9 Aug 2005US 6,926,970 B2
- Burnishing method and apparatus for providing a layer of compressive residual stress in the surface of a workpiece27 Oct 1998US 5,826,453 A
- Automated system for use in the determination of subsurface material properties by X-ray diffraction7 Apr 1998US 5,737,385 A
No published applications.
Most cited
By later US patents
- Apparatus and method for forming weld joints having compressive residual stress patterns135US 6,926,970 B22005
- Burnishing method and apparatus for providing a layer of compressive residual stress in the surface of a workpiece56US 5,826,453 A1998
- Automated system for use in the determination of subsurface material properties by X-ray diffraction4US 5,737,385 A1998