Intercon Tools, Inc.
Morgan Hill, CA, US· latest recorded location
Intercon Tools, Inc. is named on 4 US grants and 0 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 4
- Published applications
- 0
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 10 Sep 2002
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
By publication year.
Technology areas
Share of 4 documents
Recent patents
- Techniques for maintaining alignment of cut dies during substrate dicing10 Sep 2002US 6,448,156 B1
- Techniques for dicing substrates during integrated circuit fabrication4 Dec 2001US 6,325,059 B1
- Techniques for maintaining alignment of cut dies during substrate dicing13 Feb 2001US 6,187,654 B1
- Method and apparatus for securely holding a substrate during dicing26 Dec 2000US 6,165,232 A
No published applications.
Most cited
By later US patents
- Method and apparatus for securely holding a substrate during dicing22US 6,165,232 A2000
- Techniques for maintaining alignment of cut dies during substrate dicing17US 6,187,654 B12001
- Techniques for dicing substrates during integrated circuit fabrication11US 6,325,059 B12001
- Techniques for maintaining alignment of cut dies during substrate dicing4US 6,448,156 B12002