Beck Semiconductor LLC
Las Vegas, NV, US· latest recorded location
Beck Semiconductor LLC is named on 3 US grants and 5 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 3
- Published applications
- 5
- Inventors
- 4
- Granted in 2026 so far
- 0
- Most recent grant
- 13 May 2008
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 3 | 1 |
| 2009 | 0 | 1 |
By publication year.
Technology areas
Share of 8 documents
Recent patents
- Copper interconnect systems13 May 2008US 7,372,152 B2
- Copper interconnect systems which use conductive, metal-based cap layers22 Apr 2008US 7,361,589 B2
- Copper interconnect systems which use conductive, metal-based cap layers1 Apr 2008US 7,351,655 B2
- Methods of Manufacturing Copper Interconnect Systems31 Dec 2009US 2009/0321938 A1
- Copper interconnect systems24 Jul 2008US 2008/0176395 A1
- Copper interconnect systems which use conductive, metal-based cap layers9 Aug 2007US 2007/0184650 A1
- Copper interconnect systems which use conductive, metal-based cap layers9 Aug 2007US 2007/0184651 A1
- Copper interconnect systems which use conductive, metal-based cap layers27 Jul 2006US 2006/0163732 A1
Most cited
By later US patents