Production process for device
AssigneeCanon Kabushiki Kaisha
InventorKazunori Kikuchi
Life of this patent
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Abstract
A production process for a device in which a first substrate and a second substrate are bonded to each other with bonding surfaces thereof mutually bonded and the second substrate has a through-hole, the production process including the steps of bonding the first substrate and the second substrate to each other with the presence of a non-bonding region formed by a recessed shape portion recessed from at least one of the bonding surface of the first substrate and the bonding surface of the second substrate; and causing at least a part of a portion of the second substrate corresponding to the non-bonding region to pass through.
Claims19
A production process for a device in which a first substrate and a second substrate are bonded to each other with bonding surfaces thereof mutually bonded and which includes an electrode PAD on the first substrate, the production process comprising:
- bonding the first substrate and the second substrate to each other such that a non-bonding region is formed by a recessed shape portion recessed from at least one of the bonding surface of the first substrate and the bonding surface of the second substrate, and the electrode PAD is arranged in the non-bonding region;
- and
- removing, after the bonding of the first substrate and the second substrate, all parts of a portion of the second substrate corresponding to the non-bonding region so as to expose the electrode PAD on the first substrate.
A production process for a device in which a first substrate and a second substrate are bonded to each other with bonding surfaces thereof mutually bonded, the production process comprising:
- bonding the first substrate and the second substrate to each other such that a non-bonding region is formed by a recessed shape portion recessed from at least one of the bonding surface of the first substrate and the bonding surface of the second substrate;
- and
- removing, after the bonding of the first substrate and the second substrate, at least a part of a portion of the second substrate corresponding to the non-bonding region so as to form an opening that passes through the second substrate,
- wherein the recessed shape portion is formed on the bonding surfaces of both of the first substrate and the second substrate.
A production process for a device in which a first substrate and a second substrate are bonded to each other with bonding surfaces thereof mutually bonded, the production process comprising:
- bonding the first substrate and the second substrate to each other such that a non-bonding region is formed by a recessed shape portion recessed from at least one of the bonding surface of the first substrate and the bonding surface of the second substrate;
- and
- removing by dicing, after the bonding of the first substrate and the second substrate, at least a part of a portion of the second substrate corresponding to the non-bonding region so as to expose the surface of the first substrate.
A production process for a device in which a first substrate and a second substrate are bonded to each other with bonding surfaces thereof mutually bonded and which includes an electrode PAD on the first substrate, the production process comprising:
- bonding the first substrate and the second substrate to each other such that a non-bonding region is formed by a recessed shape portion recessed from at least one of the bonding surface of the first substrate and the bonding surface of the second substrate, and the electrode PAD is arranged in the non-bonding region;
- and
- removing, after the bonding of the first substrate and the second substrate, at least a part of a portion of the second substrate corresponding to the non-bonding region so as to expose the electrode PAD on the first substrate,
- wherein the second substrate has another recess, which forms a flow channel.
Dependencies are inferred from the claim text.