Semiconductor device

A semiconductor device, comprising:

• a base plate having a support surface;
• a semiconductor chip provided on the support surface, the semiconductor chip including a switching element, the switching element including a first electrode, a second electrode, and a control electrode;
• a first terminal plate including a first main body unit, the first terminal plate being electrically connected to the first electrode;
• a second terminal plate including a second main body unit, the second main body unit opposing the first main body unit at a first spacing from the first main body unit, the second terminal plate being electrically connected to the second electrode;
• a third terminal plate including a third main body unit, the third main body unit opposing the first main body unit and the second main body unit at prescribed spacings from the first main body unit and the second main body unit, the third terminal plate being electrically connected to the first electrode and the first terminal plate;
• and
• a fourth terminal plate including a fourth main body unit, the fourth main body unit opposing the third main body unit at a second spacing from the third main body unit, the fourth terminal plate being electrically connected to the second electrode and the second terminal plate,
• the second spacing being narrower than the first spacing.