Systems and methods for passive cooling of components within electrical devices

A system, comprising:

• an electrical unit comprising a first surface opposite a second surface;
• a plurality of electrical modules disposed within the electrical unit, wherein each electrical module of the plurality of electrical modules comprise a heat generating structure;
• a plurality of heat spreaders, wherein each heat spreader of the plurality of heat spreaders is coupled to a respective electrical module of the plurality of electrical modules and to a corresponding heat generating structure, wherein each heat spreader comprises:
• a body portion comprising a flat surface, wherein the flat surface is in thermal contact with at least a portion of the corresponding heat generating structure;
• and
• a shank portion comprising one or more protruding couplings;
• a heat sink disposed parallel to the second surface of the electrical unit, wherein the heat sink comprises a plurality of couplings configured to operatively couple with the one or more protruding couplings of the plurality of heat spreaders to form a physical thermal connection that facilitates heat transfer between the plurality of electrical modules and the heat sink;
• and
• a backplane adjacent to the second surface and between the plurality of heat spreaders and the heat sink.

A method, comprising:

• inserting an electrical module into an electrical unit in a first direction from a first surface of the electrical unit to a second surface of the electrical unit, wherein the first surface is opposite to the second surface, and wherein the electrical module comprises one or more pins and a heat spreader;
• establishing an electrical connection between the one or more pins of the electrical module and an electrical connector disposed on a backplane assembly of the electrical unit, wherein the backplane assembly is adjacent to the second surface of the electrical unit and is oriented parallel to and proximate to the second surface of the electrical unit, such that the backplane assembly is between the heat spreader and a heat sink;
• and
• establishing a thermal connection between the heat spreader and the heat sink disposed adjacent to a second surface of the backplane assembly, wherein one or more protruding couplings of the heat spreader are configured to interface with one or more couplings disposed within heat sink.