Tamper respondent apparatus

An apparatus, comprising;

• a tamper respondent enclosure implement comprising;
• an electrically conductive material layer section configured to substantially form continuous electrically conductive paths, in which said electrically conductive material layer section comprising at least a first and second electrically conductive material layer segment;
• an electrically non-conductive material layer section configured to substantially insulate said electrically conductive material layer, in which said electrically non-conductive material layer section comprising at least a first, second and third electrically non-conductive material layer segment;
• whereby said at least first and second conductive material layer segments and said at least first and second non-conductive material layer section are configured to form alternating successive layers;
• wherein said first electrically non-conductive material layer segment generally forms an outer layer of said enclosure;
• and
• wherein said first and second electrically conductive material layer segment forms at least an inner layer of said extrusion of said three dimensional printer device, and wherein a cohesive strength of said first conductive material layer segment is configured to be less than a cohesive strength of said first and second non-conductive material layer segment and a cohesive strength of said second conductive material layer segment is configured to be less than a cohesive strength of said second non-conductive material layer segment, in which said cohesive strength of said first conductive material layer segment is further configured to be operable to ensure attempts to delaminate said first conductive material layer segment from said first non-conductive material layer segment will result in a substantial fracture of said first conductive material layer segment and said cohesive strength of said second conductive material layer segment is further configured to be operable to ensure attempts to delaminate at least one of, said first and second conductive material layer segment from said second non-conductive material layer segment will result in a substantial fracture of at least one of, said first and second conductive material layer segment;
• and
• an electrical connector at a corner of an underside surface of said tamper respondent enclosure implement, in which said electrical connector comprise of at least two or more electrical connectors.