Rigid flexible printed circuit board and method of manufacturing the same

A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:

• a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating layer and an inner layer circuit layer formed on the internal insulating layer;
• a coverlay formed on the base substrate;
• a stop pattern formed on the coverlay of the rigid region and having a side surface exposed in the flexible region;
• a first insulating layer formed on the coverlay and formed in the rigid region;
• an outer layer circuit layer formed on the first insulating layer;
• and
• a first via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the first insulating layer and the coverlay,
• wherein a glass transition temperature of the first insulating layer is 180° C. or more.

A rigid flexible printed circuit board having a rigid region and a flexible region, comprising:

• a base substrate including a portion in the rigid region and a portion in the flexible region, and including an internal insulating layer and an inner layer circuit layer formed on the internal insulating layer;
• a coverlay formed on the base substrate;
• an insulating layer formed on the coverlay and formed in the rigid region, the insulating layer having a boundary portion, at a boundary of the rigid region adjacent to the flexible region, that is on an intermediate member interposed between the boundary portion and the coverlay;
• an outer layer circuit layer formed on the insulating layer;
• and
• a via electrically connecting the inner layer circuit layer to the outer layer circuit layer by penetrating through the insulating layer and the coverlay,
• wherein a glass transition temperature of the insulating layer is 180° C. or more.