Method, photolithography method, and method of manufacturing a semiconductor device using a pellicle film

A photolithography method comprising:

• providing a semiconductor substrate;
• providing a mask above the semiconductor substrate;
• providing a pellicle film having a plate shape that includes a first surface and a second surface opposite the first surface;
• forming an upper supporting structure on the first surface of the pellicle film, the upper supporting structure having a mesh pattern;
• forming a lower supporting structure on the second surface of the pellicle film;
• forming an opening in the lower supporting structure to form a lower supporting block;
• and
• transmitting ultraviolet through the mask and through the pellicle film to form patterns on the semiconductor substrate.

A method of manufacturing a semiconductor device, the method including:

• providing a semiconductor substrate;
• providing a mask above the semiconductor substrate;
• forming a film structure, the film structure including:
• a pellicle film having a plate shape that includes a first surface and a second surface opposite the first surface,
• a supporting structure on the first surface of the pellicle film, the supporting structure having a pattern that includes an array of holes, and
• a handling substrate on the second surface of the pellicle film, the handling substrate having an opening therethrough;
• and
• transmitting ultraviolet light through the mask and through the pellicle film to form patterns on the semiconductor substrate.