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US 9,518,320 B2Granted
Copper alloy sputtering target
AssigneeMitsubishi Materials Corporation
InventorsSatoru Mori, Toshio Sakamoto, Kiyoyuki Ookubo
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Abstract
A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu.
Claims1
A copper alloy sputtering target made of a copper alloy having a composition comprising Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities,
- wherein Ca-segregated phases in which Ca is segregated are dispersed in a matrix phase,
- the Ca-segregated phase contains Cu-dispersed phases made of Cu,
- an average grain diameter of the Ca-segregated phases is less than 10 μm, and
- an average grain diameter of the Cu-dispersed phases is set to 6 μm or less.
1 more element
Dependencies are inferred from the claim text.