3D IC computer system

A computer system, comprising

• a. One or a plural of central processing units designed by using reduced instruction set computing strategy or by using power architecture;
• b. One or a plural of three-dimensional integrated circuit packages stacked by using through-silicon via processes, consisting of said central processing units and one or a plural of dynamic random access memory chips;
• c. A liquid cooling system configured to thermally contact a cooling liquid with heat-generating components in said computer system;
• d. A closed conduit for flowing said cooling liquid including component conduits dissipating heat from said heat-generating components to said cooling liquid, a first pump driving said cooling liquid circulation in said closed conduit, a first exchanging conduit of a heat exchanger for dissipating heat;
• a supply conduit flowing said cooling liquid from a first end of said first exchanging conduit into said component conduits;
• a return conduit flowing said cooling liquid from said component conduits to a second end of said first conduit of said heat exchanger;
• e. A water tower configured to have an elevated water level higher than elevation of a large water body;
• wherein a second pump is configured to pump said cooling water from said large water body into said water tower;
• a drain outlet is configured at a lower elevation than said elevated water level to flow said cooling water out of said water tower;
• a cooling conduit configured to connect said drain outlet to a first end of said second conduit of said heat exchanger to flow said cooling water from said water tower into said heat exchanger;
• a back conduit configured to connect a second end of said second conduit of said heat exchanger to said large water body to flow said cooling water from said heat exchanger to said large water body.