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US 9,439,287 B2Granted
Multi-layer wire structure for high efficiency wireless communication
AssigneeNuCurrent, Inc.
InventorsVinit Singh, Christine A. Frysz
Life of this patent
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Abstract
A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Claims23
A structure comprising:
- a) a plurality of conductors;
- b) an insulator separating each of the conductors, thereby forming the structure configured to propagate an electrical signal through at least one of the conductors;
- and
- c) wherein the structure is capable of exhibiting a quality factor greater than 100.
1 more element
Dependencies are inferred from the claim text.