Exposure apparatus, method of controlling the same, and alignment method for exposure

A method of controlling an exposure apparatus, the method comprising:

• mounting a substrate on either of a main stage or a substrate mounting unit having a position that is adjustable by the main stage;
• obtaining information about the position of an alignment key on the substrate by an alignment key monitoring unit;
• adjusting the position of the substrate such that the alignment key is placed at a preset position;
• obtaining information about the position of an alignment mark on a mask by an alignment mark monitoring unit;
• adjusting the position of the mask such that the alignment mark is placed at a preset position;
• obtaining information about a beam of light emitted from a beam irradiation unit and passed through openings in a mask so as to form a particular pattern, by a beam monitoring unit having a position fixed with respect to the main stage, the beam monitoring unit being separated from the alignment mark monitoring unit;
• checking a monitored position of the beam incident on the beam monitoring unit based on the information about the beam obtained by the beam monitoring unit, and checking the difference between the monitored position and a preset reference position;
• and
• additionally adjusting the position of the substrate by outputting a substrate position adjustment signal to the main stage based on the difference between the monitored position and the preset reference position to account for changes in alignment of an optical unit in the beam irradiation unit or transformation of a frame due to heat generated during exposure, even though the substrate is accurately positioned with respect to the alignment key monitoring unit and the mask is accurately positioned with respect to the alignment mark monitoring unit.

A method of controlling an exposure apparatus, the method comprising:

• mounting a mask on a mask stage;
• obtaining information about the position of an alignment key on a substrate by an alignment key monitoring unit;
• adjusting the position of the substrate such that the alignment key is placed at a preset position;
• obtaining information about the position of an alignment mark on the mask by an alignment mark monitoring unit;
• adjusting the position of the mask such that the alignment mark is placed at a preset position;
• obtaining information about a beam of light emitted from a beam irradiation unit and passed through openings in a mask so as to form a particular pattern and having a position adjustable by a mask stage, in a beam monitoring unit having a position fixed with respect to a main stage, the beam monitoring unit being separated from the alignment mark monitoring unit;
• checking a monitored position of the beam incident on the beam monitoring unit based on the information about the beam obtained by the beam monitoring unit, and checking the difference between the monitored position and a preset reference position;
• and
• additionally adjusting the position of the mask by outputting a mask position adjustment signal to the mask stage based on the difference between the monitored position and the preset reference position.