Back to results
US 9,437,553 B2Granted
Electronic device
AssigneeFujitsu Component Limited
InventorsTohru Muramatsu, Takeshi Wakui, Toshiya Koyama, Masakazu Muranaga
Life of this patent
Estimating the term…
Abstract
An electronic device includes a first substrate including a first electrode formed on a surface of the first substrate, an electronic component mounted on another surface of the first substrate, a second substrate placed on the first substrate via the electronic component, and a shield disposed between the first substrate and the second substrate.
Claims10
An electronic device, comprising:
- a first substrate including a first electrode formed on a surface of the first substrate;
- a second substrate placed on the first substrate;
- a plurality of chip electronic components mounted on another surface of the first substrate;
- and
- a shield disposed between the first substrate and the second substrate;
- wherein the chip electronic components support the second substrate on the first substrate;
- wherein the shield is provided on the another surface of the first substrate;
- and
- wherein the shield supports the second substrate on the first substrate.
6 more elements
An electronic device, comprising:
- a first substrate including a first electrode formed on a surface of the first substrate;
- a second substrate placed on the first substrate;
- an electronic component mounted on another surface of the first substrate;
- and
- a shield disposed between the first substrate and the second substrate;
- wherein the second substrate is placed on the first substrate via the electronic component;
- wherein the second substrate includes a conductive layer, an insulating layer that covers the conductive layer, and a via that is formed in the insulating layer and that electrically contacts the conductive layer;
- and
- wherein the conductive layer is connected to a ground potential, and extends uniformly over the another surface of the first substrate.
6 more elements
An electronic device, comprising:
- a first substrate including a first electrode formed on a first surface of the first substrate;
- a second substrate placed over the first substrate, a first surface of the second substrate facing a second surface of the first substrate;
- a plurality of electronic components connected to both the second surface of the first substrate and the first surface of the second substrate;
- the electronic components supporting the second substrate on the first substrate;
- and
- a shield disposed between the first substrate and the second substrate, the shield being provided on the second surface of the first substrate, and the shield supporting the second substrate on the first substrate.
3 more elements
Dependencies are inferred from the claim text.