US 9,437,523 B2Granted

Two-sided jet impingement assemblies and power electronics modules comprising the same

AssigneeToyota Motor Engineering & Manufacturing North America, Inc.

InventorsShailesh N. Joshi, Ercan M. Dede

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Abstract

Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent.

Claims20

Dependent claims

A jet impingement assembly comprising:

a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise:
a fluid inlet;
a fluid outlet;
a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet;
a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold;
a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface;
and
an array of orifices extending from the distribution surface to the collection surface;
a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate;
and
a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate;
wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate.

9 more elements

A power electronics module comprising:

a jet impingement assembly comprising:
a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise:
a fluid inlet;
a fluid outlet;
a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet;
a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold;
a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface;
and
an array of orifices extending from the distribution surface to the collection surface;
a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate;
and
a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate;
wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate;
a first electronics device positioned in contact with the first heat transfer plate opposite the array of fins;
and
a second electronics device positioned in contact with the second heat transfer plate opposite the array of fins.

13 more elements

A power electronics module comprising:

a plurality of jet impingement assemblies, each jet impingement assembly comprising:
a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise:
a fluid inlet;
a fluid outlet;
a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet;
a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold;
a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface;
and
an array of orifices extending from the distribution surface to the collection surface;
a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate;
and
a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate;
wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate, wherein
the plurality of jet impingement assemblies are interleaved such that each jet impingement assembly is adjacent to at least one other jet impingement assembly, the fluid inlets of adjacent jet impingement assemblies are aligned, and the fluid outlets of adjacent jet impingement assemblies are aligned;
and
at least one electronics device is positioned between adjacent jet impingement assemblies.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/291,686Filed 30 May 2014
Published: US 2015/0348869 A13 Dec 2015
Granted: 6 Sep 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification3 codes

H10W 40/475
By flowing liquids, e.g. forced water cooling: using jet impingement
H10W 90/00
Package configurations
H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by

Family

US 2015/0348869 A1Pre-grant publication · published 3 Dec 2015
US 9,437,523 B2This patent

From the US filing history. Foreign family members aren’t listed.

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