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US 9,039,925 B2Granted
Polishing slurry composition
AssigneeUWIZ Technology Co., Ltd.
InventorsWei-Jung Chen, Wen-Tsai Tsai, Ho-Ying Wu, Song-Yuan Chang, Ming-Hui Lu
Life of this patent
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Abstract
Provided is a polishing slurry composition, including a non-ionic surfactant represented by the following formula (1) R—(OCH2CH2)x—OH formula (1) wherein x is an integer from 1 to 50, and R is selected from a group consisting of a C3-C50 alkyl group, a C6-C55 benzylalkyl group and a C6-C55 phenylalkyl group.
Claims24
A polishing slurry composition, comprising a non-ionic surfactant represented by formula (1),
- R—(OCH2CH2)x—OH formula (1)
- wherein x is an integer between 1 and 50, and
- R is selected from a group consisting of a C3-C50 alkyl group, a C6-C55 benzylalkyl group and a C6-C55 phenylalkyl group, and wherein the non-ionic surfactant is a secondary alcohol ethoxylate, a pH value of the polishing slurry composition is between 5 and 11, and based on a total weight of the polishing slurry composition, a content of the non-ionic surfactant is between 5 ppm and 100 ppm.
Dependencies are inferred from the claim text.