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US 8,787,013 B1Granted
Carrier with adjustable heat removal elements
AssigneeAmazon Technologies, Inc.
InventorsMichael P. Czamara, Osvaldo P. Morales
Life of this patent
Estimating the term…
Abstract
A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.
Claims31
A system for removing heat from a computing device, comprising:
- a carrier comprising a carrier surface having a carrier surface pattern, wherein the carrier surface pattern comprises two or more carrier surface pattern coupling portions;
- and
- one or more heat removal elements, each of the one or more heat removal elements comprising one or more coupling portions;
- wherein the carrier surface pattern coupling portions are configured to selectively couple, at one of a plurality of different locations on the pattern, at least one of the heat removal elements to the carrier via coupling a limited selection of the two or more carrier surface pattern coupling portions with the one or more coupling portions of the at least one heat removal element, such that the at least one of the two or more carrier surface pattern coupling portions is free from coupling to the at least one heat removal element;
- wherein the at least one heat removal element is configurable to conduct heat from one or more heat producing components of the computing device to the carrier;
- wherein the carrier is configured to conduct heat away from the at least one heat removal element.
3 more elements
A system for removing heat from electrical systems in a rack, comprising:
- a tray configurable to support at least one electrical system at least partially mounted on an upper surface of the tray in the rack;
- and one or more heat removal elements configurable to couple with the tray at two or more locations on the upper surface of the tray;
- wherein the one or more heat removal elements are configurable to at least partially rest on the upper surface of the tray at one of the two or more locations, wherein the heat removal element is vertically aligned beneath one or more heat producing components of the at least one electrical system at least partially mounted on the upper surface of the tray;
- wherein the one or more heat removal elements are configurable to conduct heat from the one or more heat producing components of at least one of the at least one electrical system to the tray;
- wherein the tray is configured to conduct heat away from the one or more heat removal elements.
2 more elements
A system for removing heat from computing devices comprising:
- one or more trays configured to support one or more computing devices at least partially mounted on an upper surface of the one or more trays in a rack;
- one or more heat removal elements configured to couple with at least one of the one or more trays, wherein at least one of the one or more heat removal elements is configurable to:
- couple at one or more of a plurality of locations on the upper surface of the one or more trays;
- receive one or more heat producing components of at least one of the one or more computing devices at least partially mounted on the upper surface of the one or more trays, such that the one or more heat producing components are mounted on the one or more heat removal elements;
- and conduct heat from the one or more heat producing components mounted on the one or more heat removal elements to the at least one tray at which the one or more heat removal elements is coupled;
- one or more shafts configured to couple with the one or more trays;
- wherein the one or more trays are configured to transfer heat from the one or more heat removal elements to at least one of the one or more shafts.
4 more elements
A method of removing heat from an electrical system, comprising:
- positioning one or more heat removal elements on an upper surface of a carrier, wherein the carrier comprises a carrier surface pattern configured to selectively couple at least one of the heat removal elements at two or more different locations on the carrier surface pattern;
- coupling the one or more heat removal elements to the upper surface of the carrier;
- and
- coupling the carrier with the electrical system such that:
- the electrical system is at least partially mounted on the upper surface of the carrier,
- the one or more heat removal elements at least partially rests on the upper surface of the carrier in vertical alignment beneath one or more heat producing components of the electrical system, and
- the heat removal elements carry heat away from the one or more heat producing components of the electrical system and to the carrier.
4 more elements
Dependencies are inferred from the claim text.