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US 8,786,054 B2Granted
Structure for integrated circuit alignment
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Chyi Harn, Sophia Wang, Chun-Hung Lin, Hsien-Wei Chen, Ming-Yen Chiu
Life of this patent
Estimating the term…
Abstract
A method and device for pattern alignment are disclosed. The device can include an exposure field; a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region; and a die alignment mark disposed between the seal ring region and the corner stress relief region.
Claims20
A semiconductor wafer comprising:
- an exposure field;
- a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region;
- and
- a die alignment mark disposed between the seal ring region and the corner stress relief region without being disposed within any corner stress relief region and any seal ring region,
- wherein the die alignment mark is further disposed such that there is no seal ring region between the die alignment mark and the integrated circuit region, and
- wherein the corner stress relief region is free of any seal ring region.
3 more elements
A semiconductor wafer comprising:
- an exposure field;
- a die within the exposure field, wherein the die comprises an integrated circuit region, a seal ring region, and a corner stress relief region;
- and
- a die alignment mark disposed between the seal ring region and the corner stress relief region without being disposed within any corner stress relief region and any seal ring region,
- wherein the corner stress relief region is free of any seal ring region,
- wherein there is not any seal ring region between the die alignment mark and the integrated circuit region, and
- wherein the die alignment mark comprises a first alignment mark and a second alignment mark.
4 more elements
A method comprising:
- providing a semiconductor wafer;
- defining a field on the semiconductor wafer, wherein a perimeter of the field is defined by a scribe line;
- defining a die area within the field, wherein a perimeter of the die is defined by a scribe line;
- forming an alignment mark within the scribe line defining the perimeter of the field;
- and
- forming an alignment mark in a corner portion of the die area such that the alignment mark in the corner portion is disposed between a seal ring and a corner stress relief portion and between the seal ring and a circuit region without being disposed within any corner stress relief portion and any seal ring,
- wherein there is not any seal ring between the alignment mark in the corner portion and the circuit region,
- wherein the corner stress relief portion is free of any seal ring.
5 more elements
Dependencies are inferred from the claim text.