Semiconductor die package and embedded printed circuit board

A semiconductor die package comprising:

• a semiconductor die having a wafer block with a surface, and a plurality of circuit patterns formed on the surface, wherein a respective first cross-section of each of the plurality of circuit patterns is substantially parallel to the surface;
• at least three bumps, with each bump electrically connected to a respective one of the plurality of circuit patterns, wherein each of at least three bumps has a respective second cross-section substantially parallel to the surface, and wherein each respective second cross-section of each bump has an area greater than the area of the respective first cross-section of the corresponding circuit pattern electrically connected to the respective bump;
• a bump pad disposed on the surface of the semiconductor die and having at least one opening through which the plurality of bumps extend;
• and
• a radiating pad, formed on an upper surface of the bump pad that is disposed on the surface of the semiconductor die, said radiating pad being arranged to surround the plurality of bumps to maximize a transfer of thermal energy received from the semiconductor die that is radiated by the radiating pad;
• wherein lower portions of the at least three bumps are buried in the bump pad and upper portions of the at least three bumps are exposed to an exterior,
• wherein lower and upper portions of each of the plurality of bumps have a uniform width, and
• wherein the radiating pad has a rectangular opening and the at least three bumps pass through the rectangular opening.