Semiconductor device

A semiconductor device comprising:

• a first inverter arranged at an intersection of a 1st row and a 1st column, the first inverter including a first island-shaped semiconductor layer, a first gate dielectric film surrounding a periphery of the first island-shaped semiconductor layer, a first gate electrode surrounding a periphery of the first gate dielectric film, the first gate dielectric film having a first surface surrounding an outer side surface of the first gate electrode and a second surface opposite the first surface, a first arc-shaped semiconductor layer contacting only a portion of the second surface of the first gate dielectric film, a first first-conductive-type high-concentration semiconductor layer arranged on a top of the first island-shaped semiconductor layer, a second first-conductive-type high-concentration semiconductor layer arranged underneath the first island-shaped semiconductor layer, a first second-conductive-type high-concentration semiconductor layer arranged on a top of the first arc-shaped semiconductor layer, and a second second-conductive-type high-concentration semiconductor layer arranged underneath the first arc-shaped semiconductor layer;
• a second inverter arranged at an intersection of a 2nd row and a 2nd column, the second inverter including a second island-shaped semiconductor layer, a second gate dielectric film surrounding a periphery of the second island-shaped semiconductor layer, a second gate electrode surrounding a periphery of the second gate dielectric film, the second gate dielectric film having a first surface in contact with a side surface of the second gate electrode and a second surface, a second arc-shaped semiconductor layer contacting only a portion of the second surface of the second gate dielectric film, a third first-conductive-type high-concentration semiconductor layer arranged on a top of the second island-shaped semiconductor layer, a fourth first-conductive-type high-concentration semiconductor layer arranged underneath the second island-shaped semiconductor layer, a third second-conductive-type high-concentration semiconductor layer arranged on a top of the second arc-shaped semiconductor layer, and a fourth second-conductive-type high-concentration semiconductor layer arranged underneath the second arc-shaped semiconductor layer;
• a first selection transistor arranged at an intersection of the 1st row and the 2nd column, the first selection transistor including a third island-shaped semiconductor layer, a third gate dielectric film surrounding a periphery of the third island-shaped semiconductor layer, a third gate electrode surrounding a periphery of the third gate dielectric film, a fifth second-conductive-type high-concentration semiconductor layer arranged on a top of the third island-shaped semiconductor layer, and a sixth second-conductive-type high-concentration semiconductor layer arranged underneath the third island-shaped semiconductor layer;
• and
• a second selection transistor arranged at an intersection of the 2nd row and the 1st column, the second selection transistor including a fourth island-shaped semiconductor layer, a fourth gate dielectric film surrounding a periphery of the fourth island-shaped semiconductor layer, a fourth gate electrode surrounding a periphery of the fourth gate dielectric film, a seventh second-conductive-type high-concentration semiconductor layer arranged on a top of the fourth island-shaped semiconductor layer, and an eighth second-conductive-type high-concentration semiconductor layer arranged underneath the fourth island-shaped semiconductor layer
• wherein the first inverter and the first selection transistor are connected to each other by a first output terminal and second inverter and the second selection transistor are connected to each other by a second output terminal,
• and wherein an input terminal of the first inverter is connected to the second output terminal and an input terminal of the second inverter is connected to the first output terminal;
• a fifth first-conductive-type high-concentration semiconductor layer arranged underneath the second first-conductive-type high-concentration semiconductor layer, the second second-conductive-type high-concentration semiconductor layer and the eighth second-conductive-type high-concentration semiconductor layer;
• a sixth first-conductive-type high-concentration semiconductor layer arranged underneath the fourth first-conductive-type high-concentration semiconductor layer, the fourth second-conductive-type high-concentration semiconductor layer and the sixth second-conductive-type high-concentration semiconductor layer;
• a first semiconductor-metal compound layer formed on a part of respective sidewalls of the second second-conductive-type high-concentration semiconductor layer and the fifth first-conductive-type high-concentration semiconductor layer;
• a second semiconductor-metal compound layer formed on the eighth second-conductive-type high-concentration semiconductor layer and the fifth first-conductive-type high-concentration semiconductor layer;
• a third semiconductor-metal compound layer formed on a part of respective sidewalls of the fourth second-conductive-type high-concentration semiconductor layer and the sixth first-conductive-type high-concentration semiconductor layer;
• a fourth semiconductor-metal compound layer formed on the sixth second-conductive-type high-concentration semiconductor layer and the sixth first-conductive-type high-concentration semiconductor layer;
• a fifth semiconductor-metal compound layer formed on the first first-conductive-type high-concentration semiconductor layer;
• a sixth semiconductor-metal compound layer formed on the first second-conductive-type high-concentration semiconductor layer;
• a seventh semiconductor-metal compound layer formed on the third first-conductive-type high-concentration semiconductor layer;
• an eighth semiconductor-metal compound layer formed on the third second-conductive-type high-concentration semiconductor layer;
• a ninth semiconductor-metal compound layer formed on the fifth second-conductive-type high-concentration semiconductor layer;
• a tenth semiconductor-metal compound layer formed on the seventh second-conductive-type high-concentration semiconductor layer;
• a first contact connecting the first gate electrode and the fourth semiconductor-metal compound layer;
• and
• a second contact connecting the second gate electrode and the second semiconductor-metal compound layer.

A semiconductor device comprising:

• a first inverter arranged at an intersection of a 1st row and a 1st column, the first inverter including a first island-shaped semiconductor layer, a first gate dielectric film surrounding a periphery of the first island-shaped semiconductor layer, a first gate electrode surrounding a periphery of the first gate dielectric film, the first gate dielectric film having a first surface surrounding an outer side surface of the first gate electrode and a second surface opposite the first surface, a first arc-shaped semiconductor layer contacting only a portion of the second surface of the first gate dielectric film, a first p+-type semiconductor layer arranged on a top of the first island-shaped semiconductor layer, a second p+-type semiconductor layer arranged underneath the first island-shaped semiconductor layer, a first n+-type semiconductor layer arranged on a top of the first arc-shaped semiconductor layer and a second n+-type semiconductor layer arranged underneath the first arc-shaped semiconductor layer;
• a second inverter arranged at an intersection of a 2nd row and a 2nd column, the second inverter including a second island-shaped semiconductor layer, a second gate dielectric film surrounding a periphery of the second island-shaped semiconductor layer, a second gate electrode surrounding a periphery of the second gate dielectric film, the second gate dielectric film having a first surface surrounding an outer side surface of the second gate electrode and a second surface opposite the first surface, a second arc-shaped semiconductor layer contacting only a portion of the second surface of the second gate dielectric film, a third p+-type semiconductor layer arranged on a top of the second island-shaped semiconductor layer, a fourth p+-type semiconductor layer arranged underneath the second island-shaped semiconductor layer, a third n+-type semiconductor layer arranged on a top of the second arc-shaped semiconductor layer, and a fourth n+-type semiconductor layer arranged underneath the second arc-shaped semiconductor layer;
• a first selection transistor arranged at an intersection of the 1st row and the 2nd column, the first selection transistor including a third island-shaped semiconductor layer, a third gate dielectric film surrounding a periphery of the third island-shaped semiconductor layer, a third gate electrode surrounding a periphery of the third gate dielectric film, a fifth n+-type semiconductor layer arranged on a top of the third island-shaped semiconductor layer, and a sixth n+-type semiconductor layer arranged underneath the third island-shaped semiconductor layer;
• a second selection transistor arranged at an intersection of the 2nd row and the 1st column, the second selection transistor including a fourth island-shaped semiconductor layer, a fourth gate dielectric film surrounding a periphery of the fourth island-shaped semiconductor layer, a fourth gate electrode surrounding a periphery of the fourth gate dielectric film, a seventh n+-type semiconductor layer arranged on a top of the fourth island-shaped semiconductor layer, and an eighth n+-type semiconductor layer arranged underneath the fourth island-shaped semiconductor layer
• wherein the first inverter and the first selection transistor are connected to each other by a first output terminal and second inverter and the second selection transistor are connected to each other by a second output terminal,
• and wherein an input terminal of the first inverter is connected to the second output terminal and an input terminal of the second inverter is connected to the first output terminal;
• a fifth p+-type semiconductor layer arranged underneath the second p+-type semiconductor layer, the second n+-type semiconductor layer and the eighth n+-type semiconductor layer;
• a sixth p+-type semiconductor layer arranged underneath the fourth p+-type semiconductor layer, the fourth n+-type semiconductor layer and the sixth n+-type semiconductor layer;
• a first semiconductor-metal compound layer formed on a part of respective sidewalls of the second n+-type semiconductor layer and the fifth p+-type semiconductor layer;
• a second semiconductor-metal compound layer formed on the eighth n+-type semiconductor layer and the fifth p+-type semiconductor layer;
• a third semiconductor-metal compound layer formed on a part of respective sidewalls of the fourth n+-type semiconductor layer and the sixth p+-type semiconductor layer;
• a fourth semiconductor-metal compound layer formed on the sixth n+-type semiconductor layer and the sixth p+-type semiconductor layer;
• a fifth semiconductor-metal compound layer formed on the first p+-type semiconductor layer;
• a sixth semiconductor-metal compound layer formed on the first n+-type semiconductor layer;
• a seventh semiconductor-metal compound layer formed on the third p+-type semiconductor layer;
• an eighth semiconductor-metal compound layer formed on the third n+-type semiconductor layer;
• a ninth semiconductor-metal compound layer formed on the fifth n+-type semiconductor layer;
• a tenth semiconductor-metal compound layer formed on the seventh n+-type semiconductor layer;
• a first contact connecting the first gate electrode and the fourth semiconductor-metal compound layer;
• and
• a second contact connecting the second gate electrode and the second semiconductor-metal compound layer.