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US 8,771,535 B2Granted
Sample contamination method
AssigneeKabushiki Kaisha Toshiba
InventorsYuji Yamada, Makiko Katano, Ayako Mizuno, Eri Uemura, Asuka Uchinuno, Chikashi Takeuchi
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Abstract
A sample contamination method according to an embodiment includes spraying a chemical solution containing contaminants into a casing, carrying a semiconductor substrate into the casing filled with the chemical solution by the spraying, leaving the semiconductor substrate in the casing filled with the chemical solution for a predetermined time, and carrying the semiconductor substrate out of the casing after the predetermined time passes.
Claims13
A sample contamination method, comprising:
- introducing a chemical solution containing metal contaminants in the form of chemical liquid drops into a casing;
- carrying a semiconductor substrate in a state of lying on a substrate container into the casing filled with the chemical liquid drops;
- leaving the semiconductor substrate in the casing filled with the chemical liquid drops for a first predetermined time;
- and
- carrying the semiconductor substrate out of the casing after the first predetermined time passes.
2 more elements
Dependencies are inferred from the claim text.