Semiconductor manufacturing apparatus and semiconductor manufacturing method

A semiconductor manufacturing apparatus comprising:

• a holding mechanism configured to hold a substrate rotatably;
• a nozzle configured to supply a processing solution for performing a plating process on a processing target surface of the substrate;
• a substrate rotating mechanism configured to rotate the substrate held by the holding mechanism in a direction along the processing target surface;
• a nozzle driving mechanism configured to move the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism;
• and
• a control unit configured to control the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism,
• wherein the control unit is configured to perform a first supplying process for supplying the processing solution while the nozzle driving mechanism moves the nozzle between a central portion and a periphery portion of the substrate, and the control unit is configured to perform a second supplying process for supplying the processing solution after the nozzle driving mechanism locates the nozzle at a preset position distanced away from an approximate center position of the substrate.