On-chip ferrite bead inductor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJun-De Jin, Tzu-Jin Yeh
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Abstract
A semiconductor structure having an in situ chip-level ferrite bead inductor and method for forming the same. Embodiments include a substrate, a first dielectric layer formed on the substrate, a lower ferrite layer formed on the first dielectric layer, and an upper ferrite layer spaced apart from the lower ferrite layer in the structure. A first metal layer may be formed above the lower ferrite layer and a second metal layer formed below the upper ferrite layer, wherein at least the first or second metal layer has a coil configuration including multiple turns. At least one second dielectric layer may be disposed between the first and second metal layers. The ferrite bead inductor has a small form factor and is amenable to formation using BEOL processes.
Claims20
A semiconductor structure with chip-level ferrite bead inductor comprising:
- a substrate;
- a first dielectric layer formed on the substrate;
- a lower ferrite layer formed on the first dielectric layer and an upper ferrite layer spaced vertically apart from the lower ferrite layer;
- a first metal layer formed above the lower ferrite layer;
- a second metal layer formed below the upper ferrite layer, wherein at least the first or second metal layer has a coil configuration;
- and
- at least one second dielectric layer disposed between the first and second metal layers.
A semiconductor chip with in situ ferrite bead inductor comprising:
- a substrate;
- a first dielectric layer formed on the substrate;
- a planar lower ferrite layer formed on the first dielectric layer;
- a first metal layer formed on the lower ferrite layer;
- a second dielectric layer formed on the first metal layer;
- a second metal layer formed on the second dielectric layer, the second metal layer being patterned to define a first conductive coil comprising multiple turns;
- a via electrically connecting the first conductive coil to the first metal layer;
- and
- a planar upper ferrite layer disposed above the first conductive coil.
A method for forming an in situ chip-level ferrite bead inductor comprising:
- depositing a first dielectric layer on a substrate;
- depositing a lower ferrite layer on the first dielectric layer;
- depositing a first metal layer on the lower ferrite layer;
- patterning the first metal layer to form a first conductive lead having a configuration;
- depositing a second dielectric layer on the patterned first metal layer;
- depositing a second metal layer on the second dielectric layer;
- patterning the second metal layer to form a conductive coil having multiple turns;
- and
- forming an upper ferrite layer above the patterned second metal layer.
Dependencies are inferred from the claim text.