Semiconductor device and fabrication method for the same
AssigneePanasonic Corporation
InventorsNobuyoshi Takahashi, Ichirou Matsuo
Life of this patent
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AssigneePanasonic Corporation
InventorsNobuyoshi Takahashi, Ichirou Matsuo
Estimating the term…
The semiconductor device includes: a plurality of bit lines formed in stripes in a semiconductor substrate of a first conductivity type, each of the bit lines being a diffusion layer of an impurity of a second conductivity type; a plurality of gate insulation films formed on regions of the semiconductor substrate between the bit lines; a plurality of word lines formed on the semiconductor substrate via the gate insulating films, the word lines extending in a direction intersecting with the bit lines; and a plurality of bit line isolation diffusion layers formed in regions of the semiconductor substrate between the word lines, each of the bit line isolation diffusion layers being a diffusion layer of an impurity of the first conductivity type. The bit line isolation diffusion layer includes a diffusion suppressor for suppressing diffusion of an impurity.
A semiconductor device comprising:
Dependencies are inferred from the claim text.