Vertically mounted multi-hybrid module and heat sink

An assembly comprising:

• a first hybrid assembly;
• a second hybrid assembly;
• and
• a heat sink fastened to a first circuit board and extending generally perpendicular with respect to a plane of the first circuit board, and wherein the first hybrid assembly and the second hybrid assembly are mounted on either side of the heat sink so as to be disposed generally perpendicularly with respect to the plane of the first circuit board,
• wherein the first hybrid assembly and the second hybrid assembly extend generally vertically between the first circuit board and a second circuit board, and wherein the heat sink has a center wall disposed between the first hybrid assembly and the second hybrid assembly.

A heat sink for an electronic assembly comprising:

• a first column, the first column having a substantially cylindrical shape;
• a second column disposed at a second opposing end from the first column, the second column having a substantially cylindrical shape;
• and
• a generally flat center wall extending between the first column and the second column.