Electronic apparatus with improved heat dissipation

An electronic apparatus with improved heat dissipation, comprising:

• a first body with a first shell and a second shell, wherein the first shell is pivotally connected to the second shell to form an accommodation space, and the first shell is operable to pivot relative to the second shell and thus to ascend so as to enlarge the accommodation space and form an opening between the first shell and the second shell, wherein the first body further comprises a metal mesh, wherein the metal mesh is disposed along an inner side surface of the first shell and an inner side surface of the second shell, and the metal mesh is fastened on a bottom of the first shell;
• a second body;
• a coupling device pivotally connecting the second body and the second shell so as to pivot the second body relative to the second shell for exposing or hiding the first shell;
• and
• a linkage device operable to drive the first shell to pivot relative to the second shell, wherein
• when the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.