Processing assembly for semiconductor workpiece and methods of processing same
AssigneeApplied Materials, Inc.
InventorsJason Rye, Kyle M. Hanson
Life of this patent
Estimating the term…
Abstract
A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
Claims23
A processing assembly for a semiconductor workpiece, the processing assembly comprising:
- (a) a rotor assembly capable of spinning a workpiece, wherein the rotor assembly includes first and second rotors;
- (b) a chemistry delivery assembly for delivering chemistry to the workpiece;
- and
- (c) a chemistry collection assembly for collecting spent chemistry from the workpiece, wherein the chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs.
A method of processing a semiconductor workpiece, the method comprising:
- (a) receiving a workpiece in a processing assembly, wherein the processing assembly includes a rotor assembly for rotating the workpiece, a chemistry delivery assembly, and a chemistry collection assembly including a weir assembly, wherein the rotor assembly is capable of moving to at least first and second axial positions to process the workpiece;
- (b) moving the weir assembly from a first position to a second position;
- (c) processing the workpiece when the weir assembly is in the second position;
- (d) moving the weir assembly from the second position to a third position;
- and
- (e) processing the workpiece when the weir assembly is in the third position.
A method of processing a semiconductor workpiece, the method comprising:
- (a) receiving a workpiece in a processing assembly, wherein the processing assembly includes a rotor assembly for rotating the workpiece, a chemistry delivery assembly, and a chemistry collection assembly including a weir assembly having first and second weirs;
- (b) processing the workpiece when the rotor assembly is in a first axial position, including delivering a first chemistry to the workpiece and collecting the spent first chemistry in a first weir;
- (c) moving the rotor assembly from the first axial position to a second axial position;
- and
- (d) processing the workpiece in the second axial position, including delivering a second chemistry to the workpiece and separately collecting the spent second chemistry in a second weir.
A processing assembly for a semiconductor workpiece, the processing assembly comprising:
- (a) a rotor assembly capable of spinning a workpiece, wherein the rotor assembly includes first and second workpiece receiving portions, and wherein the rotor assembly is movable to provide a first workpiece receiving portion at a first axial position and a second workpiece receiving portion at a second axial position;
- (b) a chemistry delivery assembly for delivering chemistry to the workpiece;
- and
- (c) a chemistry collection assembly for collecting spent chemistry from the workpiece, wherein the chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs.
A processing assembly for a semiconductor workpiece, the processing assembly comprising:
- (a) a rotor assembly capable of spinning a workpiece, wherein the rotor assembly is capable of moving to at least a first axial position for processing the workpiece and a second axial position for processing the workpiece;
- (b) a chemistry delivery assembly for delivering chemistry to the workpiece;
- and
- (c) a chemistry collection assembly for collecting spent chemistry from the workpiece, wherein the chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having first, second, and third weirs.
A processing assembly for a semiconductor workpiece, the processing assembly comprising:
- (a) a rotor assembly capable of spinning a workpiece, wherein the rotor assembly includes a transmission assembly including a polymer coupling for transmitting torque;
- (b) a chemistry delivery assembly for delivering chemistry to the workpiece;
- and
- (c) a chemistry collection assembly for collecting spent chemistry from the workpiece, wherein the chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs.
A processing assembly for a semiconductor workpiece, the processing assembly comprising:
- (a) a rotor assembly capable of spinning a workpiece, wherein the rotor assembly is capable of moving to at least a first axial position for processing the workpiece and a second axial position for processing the workpiece;
- (b) a chemistry delivery assembly for delivering at least first and second chemistries to the workpiece;
- and
- (c) a chemistry collection assembly for collecting spent chemistry from the workpiece, wherein the chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs that allows for the separate collection using separate channels of the at least first and second chemistries used during processing.
A method of processing a semiconductor workpiece, the method comprising:
- (a) receiving a workpiece in a processing assembly, wherein the processing assembly includes a rotor assembly, a chemistry delivery assembly, and a chemistry collection assembly including a weir assembly;
- (b) spinning the workpiece on the rotor assembly;
- (c) moving the weir assembly from a first position to a second position and processing the workpiece when the weir assembly is in the second position;
- and
- (d) moving the rotor assembly from a first axial position to a second axial position and processing the workpiece when the rotor assembly is in the second position and the weir assembly is in the second position.
A method of processing a semiconductor workpiece, the method comprising:
- (a) receiving a workpiece in a processing assembly, wherein the processing assembly includes a rotor assembly, a chemistry delivery assembly, and a chemistry collection assembly including a weir assembly;
- (b) rotating the rotor assembly using a transmission assembly including a polymer coupling for transmitting torque;
- and
- (c) moving the weir assembly from a first position to a second position and processing the workpiece when the weir assembly is in the second axial position.
Dependencies are inferred from the claim text.