Die bonder and semiconductor manufacturing method
AssigneeHitachi High-Tech Instruments Co., Ltd.
InventorsMasamichi Kihara, Yoshiaki Kishi
Life of this patent
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Abstract
The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.
Claims12
A die bonder, comprising:
- a bonding head that adsorbs a die from a wafer and bonds it to a substrate;
- a first adjustment mechanism that positions the bonding head in order to position a position of the die at predetermined accuracy;
- a second adjustment mechanism that is provided to the bonding head, and adjusts the position of the die at higher accuracy than the first adjustment mechanism;
- a positioning controller that controls the first adjustment mechanism and the second adjustment mechanism;
- a reference mark provided to a substrate or in the vicinity of the substrate;
- a first imaging means that images the reference mark and a recognition pattern provided to a bonding position of the substrate;
- a second imaging means that images the reference mark and the die brought close to the bonding position;
- and
- a misregistration detector provided with a correcting means that corrects a position of the die brought close to the bonding position based upon imaged data acquired by the first and second imaging means.
Dependencies are inferred from the claim text.