Reclaim chemistry

A liquid reclaim system, comprising:

• (a) a proximity head capable of generating a first fluid meniscus and a second fluid meniscus on a surface of a wafer, wherein the second fluid meniscus is configured to confine the first fluid meniscus to prevent evaporation of a hot liquid chemistry included in the first fluid meniscus into a gas, wherein another gas is applied to the second fluid meniscus to confine the first fluid meniscus and the second fluid meniscus to a footprint on the wafer surface, the proximity head including:
• (i) at least one first inlet configured to supply the hot liquid chemistry to the first fluid meniscus,
• (ii) at least one second inlet configured to supply a cold liquid chemistry to the second fluid meniscus;
• (b) a first supply tank coupled to the at least one first inlet via a first supply line, wherein the hot liquid chemistry is supplied from the first supply tank to the at least one first inlet along the first supply line;
• (c) a second supply tank coupled to the at least one second inlet via a second supply line, wherein the cold liquid chemistry is supplied from the second supply tank to the at least one second inlet along the second supply line;
• (d) a first apparatus coupled between at least one cold/gas outlet of the proximity head and the second supply tank, wherein the first apparatus is configured to remove the mixture of the cold liquid chemistry and the gas from the wafer surface along the at least one cold/gas outlet and into the first apparatus, and wherein the first apparatus is configured to separate the cold liquid chemistry from the gas to re-circulate the cold liquid chemistry into the second supply tank, and the first apparatus includes a vacuum tank;
• and
• (e) a second apparatus coupled between at least one hot/cold outlet of the proximity head and the first supply tank and further coupled between the at least one hot/cold outlet and the second supply tank, wherein the second apparatus is configured to remove the the hot liquid chemistry and the cold liquid chemistry from the wafer surface along the at least one hot/cold outlet and move a mixture of the hot and cold liquid chemistry into the first supply tank and the second supply tank.

A proximity head system for processing a surface of a substrate, comprising:

• (a) a proximity head for generating a first fluid meniscus and a second fluid meniscus on a surface of a substrate, the proximity head including:
• (i) a plurality of first inlets to supply a hot liquid chemistry to the first fluid meniscus, and (ii) a plurality of second inlets to supply a cold liquid chemistry to the second fluid meniscus;
• (b) a first supply tank for providing the hot liquid chemistry to the plurality of first inlets;
• (c) a second supply tank for supplying the cold liquid chemistry to the plurality of second inlets;
• and
• (d) a pump coupled to the proximity head for removing the hot liquid chemistry and the cold liquid chemistry from the surface of the substrate, the pump removing mixed hot and cold liquid chemistry from the proximity head and returning a portion to the first tank and a portion to the second tank;
• wherein on a surface of the proximity head, the plurality of second inlets are defined in an arrangement to at least partially surround the plurality of first inlets, the arrangement is configured to at least partially confine the first fluid meniscus with the second fluid meniscus to prevent evaporation of the hot liquid chemistry, included in the first fluid meniscus, into a gas.