Micro-electro-mechanical system device and method for making same
AssigneePixart Imaging Incorporation
InventorsSheng Ta Lee, Chuan Wei Wang
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Abstract
According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order; and a protrusion connected under the thin film structure. A preferred thin film structure includes at least a lower protection layer, a metal layer and an upper protection layer. The MEMS device for example is a capacitive MEMS acoustical sensor.
Claims9
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a metal layer and a protection layer deposited in any order;
- and
- a protrusion connected under the thin film structure, wherein the protrusion is not in contact with a lower layer below the protrusion when the thin film structure is not deformed, and wherein the protrusion includes a metal layer and a via layer.
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a metal layer and a protection layer deposited in any order;
- a protrusion connected under the thin film structure, wherein the protrusion is not in contact with a lower layer below the protrusion when the thin film structure is not deformed;
- and
- a guard ring under the thin film structure.
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a metal layer and a protection layer deposited in any order, wherein the protection layer is made of an insulating material;
- and
- a protrusion connected under the thin film structure, wherein the protrusion is not in contact with a lower layer below the protrusion when the thin film structure is not deformed.
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a metal layer and a protection layer deposited in any order;
- and
- a protrusion connected under the thin film structure, wherein the protrusion is not in contact with a lower layer below the protrusion when the thin film structure is not deformed, wherein the MEMS device is an acoustical sensor.
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a lower protection layer, a metal layer and an upper protection layer;
- and
- a protrusion connected under the thin film structure, wherein the protrusion is not in contact with a lower layer below the protrusion when the thin film structure is not deformed.
A micro-electro-mechanical system (MEMS) device, comprising:
- a thin film structure including at least a metal layer and a protection layer deposited in any order;
- a protrusion connected under the thin film structure;
- and
- a guard ring under the thin film structure, wherein the guard ring includes a contact layer, a metal layer and a via layer.
Dependencies are inferred from the claim text.