Thin-film lid MEMS devices and methods

An encapsulated microelectromechanical (MEMS) device comprising:

• a MEMS device encapsulated by sacrificial material;
• a lid layer over the sacrificial material, the lid layer including a plurality of etch holes formed in the lid layer, the etch holes providing access to the sacrificial material through the lid layer for removal of the sacrificial material;
• a sealing layer over the etch holes and defining a plurality of plugs corresponding to the plurality of etch holes, each of the plurality of plugs at least partially filling a corresponding etch hole and extending above the top surface of the lid layer and outside the periphery of the etch hole to prevent access to the etch hole;
• a metal layer over the sealing layer;
• and
• a barrier layer over the lid layer, the sealing layer, and the metal layer.

A method for encapsulating a microelectromechanical (MEMS) device comprising:

• encapsulating a MEMS device with sacrificial material;
• covering the sacrificial material with a lid layer;
• forming a plurality of etch holes in the lid layer, the etch holes providing access to the sacrificial material through the lid layer;
• removing the sacrificial material through the etch holes;
• covering the etch holes with a sealing layer, the sealing layer extending above the lid and preventing access to the etch holes;
• and
• patterning the sealing layer to define a plurality of plugs corresponding to the plurality of etch holes.