Lithography processes using phase change compositions
AssigneeDow Corning Corporation
InventorsWei Chen, Brian Robert Harkness, Joan Sudbury-Holtschlag, Lenin James Petroff
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Abstract
A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
Claims14
A lithographic method comprising following steps:
- A) filling a mold having a patterned surface with a phase change composition at a temperature above a phase change temperature of the phase change composition, where the phase change composition is a solid below the phase change temperature and the phase change composition is a fluid above the phase change temperature;
- followed by step
- B) contacting the phase change composition with a substrate;
- followed by step
- C) hardening the phase change composition to form a patterned feature on the substrate by cooling the phase change composition to a temperature below the phase change temperature;
- followed by step
- D) separating the mold and the patterned feature;
- optionally followed by step
- E) etching the patterned feature;
- optionally followed by step
- F) removing the phase change composition;
- optionally followed by step
- G) cleaning the mold;
- and optionally followed by step
- H) repeating steps A) to G) reusing the mold;
- to obtain a patterned feature on the substrate, with the proviso that the phase change composition comprises an organofunctional silicone wax.
A patterned feature on a substrate prepared by a lithographic method comprising following steps:
- A) filling a mold having a patterned surface with a phase change composition at a temperature above a phase change temperature of the phase change composition, where the phase change composition is a solid below the phase change temperature and the phase change composition is a fluid above the phase change temperature;
- followed by step
- B) contacting the phase change composition with a substrate;
- followed by step
- C) hardening the phase change composition to form a patterned feature on the substrate by cooling the phase change composition to a temperature below the phase change temperature;
- followed by step
- D) separating the mold and the patterned feature;
- optionally followed by step
- E) etching the patterned feature;
- optionally followed by step
- F) removing the phase change composition;
- optionally followed by step
- G) cleaning the mold;
- and optionally followed by step
- H) repeating steps A) to G) reusing the mold;
- to obtain a patterned feature on the substrate, with the proviso that the phase change composition comprises an organofunctional silicone wax and with the proviso that the patterned feature has dimensions on the order of 5 micrometers to 40 micrometers.
Dependencies are inferred from the claim text.