Method for producing an integrated circuit and arrangement comprising a substrate
AssigneeQimonda AG
InventorsPeter Baars, Stefan Tegen, Klaus Muemmler
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Abstract
Embodiments of the invention relate to an integrated circuit comprising a carrier, having a capacitor with a first electrode and a second electrode. The first electrode has a dielectric layer A layer sequence is arranged on the carrier, the capacitor being introduced in said layer sequence, wherein the layer sequence has a first supporting layer and a second supporting layer arranged at a distance above the first supporting layer, wherein the first and the second supporting layer adjoin the first electrode of the capacitor. Methods of manufacturing the integrated circuit are also provided.
Claims6
An integrated circuit, comprising:
- a carrier, the carrier comprising:
- a capacitor, the capacitor comprising a first electrode, a dielectric layer, and a second electrode;
- a first supporting layer;
- and
- a second supporting layer arranged at a greater distance from a substrate than the first supporting layer, and the first supporting layer arranged at a greater distance from the substrate than a portion of the first electrode of the capacitor,
- wherein respective portions of the first and second supporting layers are between respective portions of both the first and second electrodes and the substrate.
Dependencies are inferred from the claim text.