Electronic device, resonator, oscillator and method for manufacturing electronic device
AssigneeSeiko Epson Corporation
InventorsShogo Inaba, Akira Sato
Life of this patent
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Abstract
An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer; a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer; and a second covering layer for closing the opening.
Claims16
An electronic device comprising a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein
- the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer;
- a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer;
- and a second covering layer for closing the opening.
An electronic device comprising a substrate having a functional structural body provided in the inside of a cavity part and a CMOS circuit part placed side by side on the substrate, wherein
- a covering structure for defining the cavity part is provided with a side wall comprising an interlayer insulating layer surrounding the cavity part and a wiring layer and a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer;
- and
- at least one of the interlayer insulating layer and the wiring layer is a part of an interlayer insulating layer or a wiring layer of the CMOS circuit part.
A resonator comprising a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein
- the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer surrounding the cavity part and a wiring layer;
- a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer;
- and a second covering layer for closing the opening.
An oscillator comprising a substrate having a functional structural body provided in the inside of a cavity part and an oscillation circuit-containing CMOS circuit part placed side by side on the substrate, wherein
- a covering structure for defining the cavity part is provided with a side wall comprising an interlayer insulating layer surrounding the cavity part and a wiring layer and a first covering layer covering an upper portion of the cavity part and having an opening penetrating through the cavity part and composed of a laminated structure including a corrosion-resistant layer;
- and
- at least one of the interlayer insulating layer and the wiring layer is a part of an interlayer insulating layer or a wiring layer of the CMOS circuit part.
A method for manufacturing an electronic device including a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, comprising
- a functional structural forming process of forming the functional structural body together with a sacrifice layer on the substrate;
- an interlayer insulating layer forming process of forming an interlayer insulating layer in the periphery including an upper part of the functional structural body;
- a first covering layer forming process of forming a first covering layer composed of a laminated structure including a corrosion-resistant layer on the interlayer insulating layer and having an opening;
- a release process of removing the interlayer insulating layer and the sacrifice layer on the functional structural body through the opening;
- and
- a second covering layer forming process of forming a second covering layer for closing the opening.
A method for manufacturing an electronic device including a substrate having a functional structural body provided in the inside of a cavity part and a CMOS circuit part placed side by side on the substrates comprising
- forming the functional structural body together with a sacrifice layer on the substrate;
- forming a CMOS transistor;
- forming an interlayer insulating layer in the periphery including an upper part of the functional structural body and an upper part of the CMOS transistor;
- forming a first covering layer for covering the cavity part and having an opening, a wiring layer connected to the functional structural body and a wiring layer connected to the CMOS transistor in an upper part of the interlayer insulating layer;
- forming a passivation membrane in the periphery including the first covering layers the wiring layer connected to the functional structural body and the wiring layer connected to the CMOS transistor;
- removing the interlayer insulating layer and the sacrifice layer on the functional structural body through the opening;
- and
- forming a second covering layer for closing the opening.
Dependencies are inferred from the claim text.