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US 7,745,305 B2Granted
Method of removing an oxide and method of filling a trench using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-Heon Lee, Kyu-Tae Na, Ju-Wan Kim, Taek-Jung Kim
Life of this patent
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Abstract
A method of removing a portion of an oxide layer includes forming first byproducts by reacting a reaction gas with the oxide layer, the reaction gas including fluorine and nitrogen, reacting the reaction gas with the first byproducts to form second byproducts, and removing the second byproducts.
Claims15
A method of filling a trench, the method comprising:
- forming at least one first trench to extend from an upper surface of a substrate in a downward direction;
- forming a first oxide layer conformably on the substrate, such that the first trench is partially filled with the first oxide layer;
- removing a portion of the first oxide layer by reacting a reaction gas including fluorine and nitrogen with the first oxide layer to form a partially etched first oxide layer, the partially etched first oxide layer defining at least one second trench;
- and
- forming a second oxide layer on the partially etched first oxide layer, such that the second trench is filled with the second oxide layer,
- wherein removing a portion of the first oxide layer includes forming first byproducts via a reaction between the first oxide layer and the reaction gas, reacting the first byproducts with the reaction gas to form second byproducts, and removing the second byproducts.
3 more elements
Dependencies are inferred from the claim text.