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US 7,745,101 B2Granted
Nanoparticle patterning process
AssigneeEastman Kodak Company
InventorsLee W. Tutt, Therese M. Feller
Life of this patent
Estimating the term…
Abstract
A method of making a metallic pattern (250) comprises: depositing a layer of photoresist (130) on a substrate (110); forming a pattern on the photoresist; depositing a layer of metal nanoparticles (190) on the photoresist and pattern; removing the photoresist and overlying metal nanoparticles on the photoresist; and sintering the remaining nanoparticles to form a metallic pattern.
Claims14
A method of making a metallic pattern comprising:
- depositing a layer of photoresist on a substrate;
- forming a pattern of opening in said photoresist;
- depositing a layer of metal nanoparticles on said photoresist and on said pattern;
- removing said photoresist and overlying metal nanoparticles on said photoresist;
- and
- sintering the remaining said nanoparticles to form a metallic pattern.
3 more elements
A method of making a metallic pattern comprising:
- depositing a layer of thermal resist on a substrate;
- forming a pattern of opening in said thermal resist;
- depositing a layer of metal nanoparticles on said thermal resist and pattern;
- removing remaining thermal resist and overlying metal nanoparticles on said remaining thermal resist;
- and
- sintering remaining said nanoparticles to form a metallic pattern.
3 more elements
Dependencies are inferred from the claim text.