IC socket and IC socket assembly
AssigneeTyco Electronics Japan G.K.
InventorsHidenori Taguchi, Shinichi Hashimoto
Life of this patent
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AssigneeTyco Electronics Japan G.K.
InventorsHidenori Taguchi, Shinichi Hashimoto
Estimating the term…
An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.
An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof, comprising:
An IC socket assembly comprising an IC package having a plurality of electrical contacts on a bottom face thereof and further comprising an IC socket that receives the IC package, the IC socket comprising:
Dependencies are inferred from the claim text.