Electronic apparatus interconnect routing

An electronic apparatus formed on a substrate, the electronic apparatus comprising:

• a first plurality of polysilicon fingers coupled to the substrate at a first level, wherein the first plurality of polysilicon fingers are elongated along first lengthwise axes;
• a first interconnect formed of a first metal layer and coupled to each polysilicon finger of the first plurality of polysilicon fingers, wherein the first interconnect has a first lengthwise axis that is perpendicular to the first lengthwise axes of the first plurality of polysilicon fingers;
• a second plurality of polysilicon fingers coupled to the substrate at the first level and interdigitated with the first plurality of polysilicon fingers, wherein the second plurality of polysilicon fingers are elongated along second lengthwise axes that are parallel with the first lengthwise axes of the first plurality of polysilicon fingers;
• and
• a second interconnect formed of a second metal layer that is a different layer from the first metal layer, the second interconnect being coupled to each polysilicon finger of the second plurality of polysilicon fingers, wherein the second interconnect has a second lengthwise axis that is perpendicular to the second lengthwise axes of the second plurality of polysilicon fingers, and the second lengthwise axis is parallel to and different from the first lengthwise axis.