Microstructure and manufacturing method thereof and microelectromechanical system

A manufacturing method of a microstructure comprising:

• forming a lower electrode on and in contact with a first region of an insulating surface;
• forming a sacrificial layer to cover the lower electrode;
• forming a first conductive film comprising a crystal to cover the sacrificial layer;
• growing the crystal by melting and recrystallizing the crystal;
• forming a second conductive film over the first conductive film;
• etching a portion of the first conductive film and a portion of the second conductive film to expose a portion of the sacrificial layer;
• and
• removing the sacrificial layer after etching the portion of the first conductive film and the portion of the second conductive film,
• wherein the first region is provided between a second region and a third region of the insulating surface,
• wherein the etched first conductive film is on and in contact with the second region of the insulating surface and the third region of the insulating surface, and
• wherein the etched first conductive film is provided over the lower electrode.