Method for producing a polymer structure on a substrate surface
AssigneeInfineon Technologies AG
InventorsMartin Franosch, Andreas Meckes, Klaus-Guenter Oppermann
Life of this patent
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Abstract
A method for producing a polymer structure on a patterning region of a substrate surface includes the steps of depositing an adhesion layer having a first polymer material onto the substrate surface, patterning the adhesion layer such that the first polymer material of the adhesion layer is removed in a first region and the first polymer material of the adhesion layer remains in a second region including the patterning region, depositing a polymer layer of a second polymer material onto the substrate surface and the adhesion layer and patterning the polymer layer such that the polymer structure forms in the second region.
Claims15
Method for producing a polymer structure, comprising the steps of:
- depositing an adhesion layer comprising a first photoresist polymer onto a substrate surface;
- patterning the adhesion layer such that the first photoresist polymer of the adhesion layer is removed in a first region and the first photoresist polymer of the adhesion layer remains in a second region;
- providing a polymer layer of a second photoresist polymer on the adhesion layer over substantially only the second region;
- wherein the second photoresist polymer comprises SU-8 of a first viscosity and the first photoresist polymer comprises SU-8 of a second viscosity being higher than the first viscosity by a factor in a range from 5 to 15 and wherein a thickness of the polymer layer is greater than a thickness of the adhesion layer by a factor in a range from 4 to 1000.
A method, comprising:
- providing an adhesion layer comprising a first photoresist polymer onto a substrate surface, the adhesion layer absent from a first region of the substrate and the adhesion layer occupying a second region of a substrate, the adhesion layer having a first thickness;
- and
- providing a polymer layer of a second photoresist polymer on the adhesion layer in substantially only the second region, the polymer layer having a second thickness at least four times the first thickness;
- wherein the first and the second photoresist polymers comprise SU-8;
- and
- wherein the steps of providing are performed such that a distance of an outline edge of a patterning region within which the polymer layer overlays the adhesion layer, and an outline edge of the second region is, at least over half of a length of the outline edge of the second region, in a range from 0.1 μm to 5 μm.
Dependencies are inferred from the claim text.