Method of manufacturing mask blank and method of manufacturing mask
AssigneeHoya Corporation
InventorHideo Kobayashi
Life of this patent
Estimating the term…
Abstract
To prevent foreign matters from adhering to a substrate, etc., thereby causing inconveniences during storing and transporting a mask blank, or during manufacturing the mask blank and a mask. Thin films 2 and 3 formed in a mask thin film forming step of a mask blank manufacturing steps are covered by a dust-free protective film 5 formed of water-soluble material, thereby preventing foreign matters from adhering to the surface of the mask blank itself and preventing the surface of the mask blank from being damaged in the subsequent step, and when the mask blank is used, the dust-free protective film is removed.
Claims16
A method of manufacturing a mask blank used as a material of a pattern transfer mask, having a substrate and a thin film optically relating to a transfer exposure light which is a material of a pattern transfer mask, comprising:
- forming the thin film on the surface of the substrate;
- and
- forming a dust-free protective film which is formed of a material removable by solvent which does not affect the thin film, so that the thin film is covered by the dust-free protective film,
- wherein an unnecessary part formed on a peripheral edge of the substrate of the dust-free protective film is removed by the solvent, thereby preventing a surface of the mask blank itself from direct adhesion of foreign matters and from thereby being damaged in the subsequent step, and when the pattern transfer mask is manufactured from the mask blank, the dust-free protective film is removed by the solvent before a resist film forming step for forming a resist film on the thin film.
A method of manufacturing a mask blank used as a material of a pattern transfer mask, having a substrate, a thin film optically relating to a transfer exposure light which is a material of a pattern transfer mask, and a resist film used for a mask manufacture process, comprising:
- forming the thin film on the surface of the substrate;
- forming the resist film on the thin film;
- and
- forming a dust-free protective film which is formed of a material removable by solvent which does not affect the thin film and the resist film so that the thin film is covered by the dust-free protective film,
- wherein an unnecessary resist formed on a peripheral edge of the substrate is removed, and
- an unnecessary part formed on the peripheral edge of the substrate of the dust-free protective film is removed by the solvent, thereby preventing a surface of the mask blank itself from direct adhesion of foreign matters and from thereby being damaged in the subsequent step, and when the pattern transfer mask is manufactured from the mask blank, the dust-free protective film is removed by the solvent before exposure processing of the mask pattern formed on the thin film is performed to the resist film.
Dependencies are inferred from the claim text.