Pattern forming method, computer program thereof, and semiconductor device manufacturing method using the computer program
AssigneeKabushiki Kaisha Toshiba
InventorsToshiya Kotani, Hirotaka Ichikawa
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AssigneeKabushiki Kaisha Toshiba
InventorsToshiya Kotani, Hirotaka Ichikawa
Estimating the term…
A pattern of a desired size is formed on a semiconductor substrate by the following procedure. A property, including at least one of an aberration of an exposure device, a property of an illumination, a property of a projection lens, and a pattern coverage in a shot, are allocated, in a first database, to predetermined positions assigned in a chip. A second database is prepared by pairing a cell name of a cell extracted from hierarchical processing of a design pattern and arrangement positional data of the cell. The property data is allocated to the cell based on the first and second databases. Mask data processing based on at least one of the property data is executed, and the cell subjected to the mask data processing is rearranged on the chip.
A pattern forming method for forming a pattern of a desired size on a substrate of a semiconductor device, comprising:
A computer program for pattern formation, the program being stored in a computer readable medium, the program which when executed by a processor will perform a process comprising:
A semiconductor device manufacturing method comprising:
Dependencies are inferred from the claim text.