Heat dissipation device with heat pipe

A computer system comprising:

• a computer enclosure having first and second parallel panels and a third panel interconnecting the first and second panels, wherein the first panel defining an air exhaust therein, the second panel defining a first air intake therein and the third panel defining a second air intake therein;
• a printed circuit board received in the computer enclosure;
• first and second electronic devices mounted on the printed circuit board;
• a first heat sink having a base mounted on the first electronic device, a first fin unit mounted on the base, a second fin unit located adjacent to the second air intake and a third fin unit located adjacent to the air exhaust;
• and
• heat transferring means thermally connecting the base, the second fin unit and the third fin unit together for transferring heat from the base to the second fin unit and the third fin unit;
• and
• a second heat sink mounted on the second electronic device;
• wherein when a first airflow flows from the first air intake to the air exhaust, the first airflow flows through the first fin unit, the second heat sink and the third fin unit to the air exhaust and wherein when a second airflow flows from the second air intake to the air exhaust, the second airflow flows through the second fin unit, the second heat sink and the third fin unit to the air exhaust.