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US 7,612,429 B2Granted
Chip resistor, process for producing the same, and frame for use therein
AssigneeRohm Co., Ltd.
InventorsTorayuki Tsukada, Tadatoshi Miwa
Life of this patent
Estimating the term…
Abstract
A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.
Claims16
A chip resistor comprising:
- a chip resistor body made of a metal and having a front surface, a rear surface provided at an interval in a thickness direction, a pair of side surfaces extending in a length direction at an interval in a width direction, and a pair of end surfaces provided at an interval in the length direction;
- a plurality of electrodes provided in series on the rear surface of the resistor body at intervals in the length direction, the plurality of electrodes being formed by plating;
- a metal coating layer covering a respective one of the electrodes and a respective one of the end surfaces;
- a first insulation layer covering a region between the plurality of electrodes on the rear surface of the resistor body;
- a second insulation layer covering the pair of side surfaces of the resistor body;
- and
- a third insulation layer covering the front surface of the resistor body;
- wherein each of the electrodes and the metal coating layer overlap a portion of the first insulation layer, said portion of the first insulation layer being held in direct contact with the rear surface of the resistor body and inserted between the metal coating layer and the rear surface of the resistor body, the metal coating layer extending beyond the respective electrode into direct contact with the first insulation layer,
- wherein the plurality of electrodes comprises two or more pairs of electrodes.
6 more elements
A manufacturing method for chip resistors each of which comprises:
- a chip resistor body having a front surface, a rear surface provided at an interval in a thickness direction, a pair of side surfaces extending in a length direction at an interval in a width direction, and a pair of end surfaces provided at an interval in the length direction;
- a plurality of electrodes provided in a series on the rear surface of the resistor body at intervals in the length direction;
- a metal coating layer covering a respective one of the electrodes and a respective one of the end surfaces;
- a first insulation layer covering a region between the plurality of electrodes on the rear surface of the resistor body;
- and
- a second insulation layer covering a pair of side surfaces of the resistor body;
- wherein each of the electrodes and the metal coating layer overlap a portion of the first insulation layer, said portion of the first insulation layer being inserted between the metal coating layer and the rear surface of the resistor body, the metal coating layer extending beyond the respective electrode into direct contact with the first insulation layer,
- the method comprising the steps of:
- producing a resistor aggregate shaped into a bar, the resistor aggregate made of a metal and having a rear face provided with a multiplicity of electrodes, the multiplicity of electrodes being formed by plating and arranged at intervals in a longitudinal direction of the resistor aggregate, regions between the multiplicity of electrodes on the rear face are covered with a first insulation layer, the resistor aggregate having a pair of side surfaces covered with a second insulation layer;
- and
- dividing the resistor aggregate into a plurality of chip resistors by cutting the resistor aggregate at a plurality of locations in the longitudinal direction of the resistor aggregate.
8 more elements
A manufacturing method for chip resistors each of which comprises:
- a chip resistor body having a front surface, a rear surface provided at an interval in a thickness direction, a pair of side surfaces extending in a length direction at an interval in a width direction, and a pair of end surfaces provided at an interval in the length direction;
- a plurality of electrodes provided in a series in the rear surface of the resistor body at intervals in the length direction;
- a metal coating layer covering a respective one of the electrodes and a respective one of the end surfaces;
- a first insulation layer covering a region between the plurality of electrodes on the rear surface of the resistor body;
- and
- a second insulation layer covering the pair of side surfaces of the resistor body;
- wherein each of the electrodes and the metal coating layer overlap a portion of the first insulation layer, said portion of the first insulation layer being inserted between the metal coating layer and the rear surface of the resistor body, the metal coating layer extending beyond the respective electrode into direct contact with the first insulation layer,
- the method comprising the steps of:
- producing a resistor aggregate shaped into a bar, the resistor aggregate made of a metal and having a rear face provided with a multiplicity of electrodes, the multiplicity of electrodes being formed by plating and arranged at intervals in a longitudinal direction of the resistor aggregate between the multiplicity of electrodes on the rear face covered with a first insulation layer;
- dividing the resistor aggregate into a plurality of chip resistors by cutting the resistor aggregate at a plurality of locations in a longitudinal direction of the resistor aggregate, each of the chip resistors having side surfaces;
- and
- forming a second insulation layer on the side surfaces of each of the chip resistors.
9 more elements
A manufacturing method for chip resistors each of which comprises,
- a chip resistor body having a front surface, a rear surface provided at an interval in a thickness direction, a pair of side surfaces extending at a length direction at an interval in a width direction, and a pair of end surfaces provided at an interval in the length direction;
- a plurality of electrodes provided in a series on the rear surface of the resistor body at intervals in the length direction;
- a metal coating layer covering a respective one of the electrodes and a respective one of the end surfaces;
- a first insulation layer covering a region between the plurality of electrodes on the rear surface of the resistor body;
- and
- a second insulation layer covering the pair of side surfaces of the resistor body;
- wherein each of the electrodes and the metal coating layer overlap a portion of the first insulation layer, said portion of the first insulation layer being inserted between the metal coating layer and the rear surface of the resistor body, the metal coating layer extending beyond the respective electrode into direct contact with the first insulation layer,
- the method comprising the steps of:
- preparing a frame of a conductive material comprising a plurality of bar portions extending in a predetermined direction, each bar portion made of a metal and having a front surface, a rear surface, and a pair of side surfaces, the frame also comprising a support portion for supporting the plurality of bar portions;
- producing a plurality of resistor aggregates by forming, on the rear surface of each of the bar portions, a multiplicity of electrodes by plating, the multiplicity of electrodes being arranged at intervals in the predetermined direction and a first insulation layer positioned in regions between the plurality of electrodes, followed by forming a second insulation layer on the pair of side surfaces of each of the bar portions;
- and
- dividing each of the resistor aggregates into a plurality of chip resistors.
9 more elements
A chip resistor comprising:
- a chip resistor body made of a metal and having a front surface, a rear surface provided at an interval in a thickness direction, a pair of side surfaces extending in a length direction at an interval in a width direction, and a pair of end surfaces provided at an interval in the length direction;
- a plurality of electrodes provided in a series on the rear surface of the resistor body at intervals in the length direction, the plurality of electrodes being formed by plating;
- a metal coating layer covering a respective one of the electrodes and a respective one of the end surfaces;
- a first insulation layer covering a region between the plurality of electrodes on the rear surface of the resistor body;
- and
- a second insulation layer covering the pair of side surfaces of the resistor body;
- wherein each of the electrodes and the metal coating layer overlap a portion of the first insulation layer, said portion of the first insulation layer being held in direct contact with the rear surface of the resistor body and inserted between the metal coating layer and the rear surface of the resistor body, the metal coating layer extending beyond the respective electrode into direct contact with the first insulation layer,
- wherein each of the plurality of electrodes is held in direct contact with the rear surface of the resistor body.
5 more elements
Dependencies are inferred from the claim text.