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US 7,611,182 B2Granted
Wafer transfer apparatus
AssigneeSemes Co., Ltd.
InventorsWoo-Young Kim, In-Ho Bang, Taek-Youb Lee
Life of this patent
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Abstract
A wafer transfer apparatus may include a robot arm unit configured to be operated by a driving means, a blade configured to support a wafer and having a fix finger at a first end, and a clamping member attached to the robot arm. The clamping arm may also include a movable finger configured to hold a peripheral edge of the wafer, and a moving pusher attached to the movable finger and configured to guide the movable finger and the wafer on the blade towards the fix finger.
Claims12
A wafer transfer apparatus comprising:
- a robot arm unit;
- a blade having two end portions, one end portion operably connected to the robot arm unit, the second end portion having a fix finger at a peripheral edge thereof, and the blade configured to support a wafer;
- a clamping arm attached to the robot arm unit, the clamping arm including:
- a movable finger configured to engage and disengage a peripheral edge of a wafer,
- a moving pusher attached to the movable finger at a first end and configured to guide the movable finger and the wafer on the blade towards the fix finger;
- and
- a case including at least one stopper configured to regulate the movement of the moving pusher, wherein the at least one stopper is a screw, and a spring for controlling a speed of the moving pusher and configured to absorb a shock produced when the moving pusher contacts the wafer.
4 more elements
Dependencies are inferred from the claim text.