Heat dissipation device with heat pipes

A heat dissipation device adapted for cooling an electronic component, comprising:

• a base plate adapted for contacting with the electronic component, the base plate defining a pair of V-shaped first grooves along diagonal corners thereof, each of the V-shaped first grooves forming a V-shape approximately parallel to a surface of the base plate, the V-shaped first grooves having openings oriented opposite to each other and the openings of the V-shape each facing a corresponding corner of the base plate;
• a fin group soldered to the base plate;
• a first heat pipe having an evaporating portion soldered to the base plate and a condensing portion;
• and
• a second heat pipe having an evaporating portion soldered to the base plate and a condensing portion extending across the fin group, the condensing portion of the second heat pipe being located between the evaporating and condensing portions of the first heat pipe;
• wherein the evaporating portions of the first and second heat pipes are oriented back to back and received in the V-shaped first grooves of the base plate, and the condensing portions of the first and second heat pipes are oriented in directions perpendicular to each other.

A heat dissipation device for dissipating heat generated by an electronic component, comprising:

• a base plate having a bottom surface for contacting with the electronic component and a top surface opposite the bottom surface, the top surface defining two V-shaped grooves therein along diagonal corners of the base plate, the two V-shaped grooves being oriented back to back, each of the V-shaped grooves forming a V-shape approximately parallel to the top surface or the bottom surface of the base plate;
• a fin group mounted on the base plate and thermally connecting therewith;
• two heat pipes each having a heat absorbing section, a heat dissipating section and a heat transferring section interconnecting the heat absorbing section and the heat dissipating section;
• wherein the heat absorbing sections of the two heat pipes are accommodated in the grooves, respectively, and thermally connect with the base plate and the fin group, one of the heat dissipating sections is located adjacent to a top of the fin group and thermally connects therewith, the other of the heat dissipating sections extends below the one of the heat dissipating sections and thermally connects with the fin group, the two heat dissipating sections being oriented perpendicular to each other;
• and
• wherein the V-shaped grooves each define an opening of the V-shape facing a corresponding corner of the base plate.