US 7,610,814 B2Granted

Micromechanical device comprising a mobile beam

AssigneeCommissariat a l'Energie Atomique

InventorsGatien Fleury, Pierre-Louis Charvet

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Abstract

The micromechanical device comprises a mobile beam attached via the two ends thereof to a rigid frame comprising two arms each having two ends. The ends of an arm are respectively secured to the two ends of the mobile beam. Each arm has a middle part arranged between the two ends of the corresponding arm. A rear face of the middle part of each arm is attached to a base support. The frame comprises at least one stressed element enabling the state of stress of the beam to be adjusted. The stressed element can be centered between the front face and the rear face of the corresponding arm. The frame can comprise pairs of front and rear stressed elements arranged facing one another respectively on the front face and on the rear face of the arms.

Claims14

Dependent claims

A micromechanical device comprising:

a base support;
an annular frame parallel to the base support;
a mobile beam having two ends and forming a portion of the micromechanical device that can sag, the beam being attached via the two ends thereof to the annular frame, the beam having a predetermined stressed state;
and
means for controlling the sag of the beam, perpendicular to the base support, comprising at least one stressed element belonging to the annular frame and enabling the state of stress of the beam to be adjusted,
wherein the annular frame is more rigid than the beam and comprises two arms, each arm of the annular frame having two ends respectively secured to the two ends of the mobile beam and each arm of the annular frame having a middle part arranged between the two ends of the corresponding arm, the arms and the middle parts of the arms presenting a front face and a rear face, the rear face of the middle part of each arm being attached to the base support and the ends of the arms being free from attachment to the base support.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/794,807Filed 2 Feb 2006
Priority: FR 05 012398 Feb 2005
Published: US 2008/0148864 A126 Jun 2008
Granted: 3 Nov 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

B81C 1/00666
Mechanical properties: treatments for controlling internal stress or strain in MEMS structures
B81B 2201/016
Characterised by the shape: having a bridge fixed on two ends and connected to one or more dimples
B81C 2201/0167
Controlling internal stress of deposited layers: by adding further layers of materials having complementary strains, i.e. compressive or tensile…
B81C
Processes or apparatus specially adapted for the manufacture or treatment of microstructural

Family

US 2008/0148864 A1Pre-grant publication · published 26 Jun 2008
US 7,610,814 B2This patent

From the US filing history. Foreign family members aren’t listed.

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