Package structure for panel module and method using the same
AssigneeAu Optronics Corporation
InventorsChung-Kuan Ting, Shih-Chi Chen, Wen-Yuan Chang, Chia-Chung Wu
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Abstract
A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.
Claims5
A package structure for loading a panel module, wherein the panel module comprises a substrate, a circuit module, and a flexible printed circuit board connected to the substrate and the circuit module, at least one gap being formed between the substrate, the circuit module, and the flexible printed circuit board, the package structure comprising:
- a base having a first loading surface, and a depression area on the first loading surface for loading the panel module;
- at least one first engaging portion on the first loading surface disposed corresponding to the gap;
- a cover having first covering surface;
- and
- a second engaging portion formed on the cover and corresponding to the first engaging portion;
- a connecting bar passing through the base and the cover via the first engaging portion and the second engaging portion, wherein the first engaging portions and the second engaging portions are holes.
Dependencies are inferred from the claim text.