US 7,608,914 B1Granted

Integrated circuit package with electrically isolated leads

AssigneeCypress Semiconductor Corporation

InventorsBrett Alan Spurlock, Carlo Melendez Gamboa, Bo Soon Chang

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Abstract

In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned such that they may be encapsulated by an electrically insulating packaging material on the back of the lead frame. Portions of the lead frame having external electrical connections may have a thickness such that they are exposed through the packaging material. The lead frame may be covered by an electrically insulating cover to protect components on the lead frame from erroneous electrical contact or electrostatic discharge (ESD) damage.

Claims11

Dependent claims

An integrated circuit packaging structure comprising:

a first die paddle portion and a second die paddle portion that are physically separated, the first die paddle portion being thicker than the second die paddle portion;
a first component mounted on the first die paddle portion;
a first set of leads, each lead in the first set of leads having an exposed portion and an isolated portion;
a second set of leads forming a single piece with the second die paddle portion;
an electrically insulating packaging material formed over the second set of leads, the isolated portions of the leads in the first set of leads, and the second die paddle portion such that the exposed portions of the leads in the second set of leads are exposed for external electrical connection through the packaging material;
and
an electrically insulating cover covering a top and side of the second set of leads, the cover covering a top and a side of at least one lead in the first set of leads.

4 more elements

Dependencies are inferred from the claim text.